[PATCH 3/5] mtd: spi-nor: spansion: Add MCP support in octal_dtr_enable()

[Michael Walle]

Hi,

>>> S28HS02GT is multi-chip package (MCP) device that requires Octal DTR
>>> configuraion for each die. We can access to configuration registers 
>>> in each
>>> die by using params->n_dice and params->vreg_offset[] populated from 
>>> SFDP.
>> 
>> I'm looking into cleaning up the flash db and come across the n_banks
>> and n_dice parameter. Which sounds like they seem to be similar, maybe
>> identical? Unfortunately, there is no public datasheet for the 
>> macronix
>> flash.. IIRC there is one for the Semperflashes but I'm not sure if 
>> there
>> is one for the MCP parts.
>> Could we somehow clarify if these are the same properties? I've looked 
>> at
>> the SFDP tables of the macronix flash and they don't have the SCCR map 
>> for
>> multi chip devices :/
>> 
>> -michael
> 
> The n_banks and n_dice are different properties. One die can contain 
> multiple
> banks. Infineon does not have multi-bank parts that support RWW. The 
> SEMPER
> MCP parts do not support RWW on different die.

Ok. thanks for the quick answer!

-michael