[PATCH 3/5] mtd: spi-nor: spansion: Add MCP support in octal_dtr_enable()

[Takahiro Kuwano]

Hi Michael,

On 7/18/2023 7:49 AM, Michael Walle wrote:
> Hi Takahiro, Hi Miquel,
> 
>> S28HS02GT is multi-chip package (MCP) device that requires Octal DTR
>> configuraion for each die. We can access to configuration registers in each
>> die by using params->n_dice and params->vreg_offset[] populated from SFDP.
> 
> I'm looking into cleaning up the flash db and come across the n_banks
> and n_dice parameter. Which sounds like they seem to be similar, maybe
> identical? Unfortunately, there is no public datasheet for the macronix
> flash.. IIRC there is one for the Semperflashes but I'm not sure if there
> is one for the MCP parts.
> Could we somehow clarify if these are the same properties? I've looked at
> the SFDP tables of the macronix flash and they don't have the SCCR map for
> multi chip devices :/
> 
> -michael

The n_banks and n_dice are different properties. One die can contain multiple
banks. Infineon does not have multi-bank parts that support RWW. The SEMPER
MCP parts do not support RWW on different die.

Thanks,
Takahiro