[PATCH] dt-bindings: thermal: Get rid of thermal.txt and replace references
Amit Kucheria
amit.kucheria at verdurent.com
Mon Jul 20 07:46:57 EDT 2020
On Mon, Jul 20, 2020 at 5:13 PM Amit Kucheria <amit.kucheria at linaro.org> wrote:
>
> Now that we have yaml bindings for the thermal subsystem, get rid of the
> old bindings (thermal.txt).
>
> Replace all references to thermal.txt in the Documentation with a link
> to the appropriate YAML bindings using the following search and replace
> pattern:
> - If the reference is specific to the thermal-sensor-cells property,
> replace with a pointer to thermal-sensor.yaml
> - If the reference is to the cooling-cells property, replace with a
> pointer to thermal-cooling-devices.yaml
> - If the reference is generic thermal bindings, replace with a
> reference to thermal*.yaml.
>
> Signed-off-by: Amit Kucheria <amit.kucheria at linaro.org>
Please ignore. Forgot to add Rob's Ack and annotate with v2. Will resend.
> ---
> Changes since v1:
> - Rebase onto v.5.8-rc6 to make it apply again
> - Fix cpufreq/nvidia,tegra20-cpufreq.txt
> - Fix bindings/arm/freescale/fsl,scu.txt
>
>
> .../devicetree/bindings/arm/arm,scmi.txt | 2 +-
> .../devicetree/bindings/arm/arm,scpi.txt | 2 +-
> .../bindings/arm/freescale/fsl,scu.txt | 2 +-
> .../arm/marvell/ap80x-system-controller.txt | 2 +-
> .../arm/marvell/cp110-system-controller.txt | 2 +-
> .../bindings/cpufreq/cpufreq-dt.txt | 3 +-
> .../bindings/cpufreq/cpufreq-mediatek.txt | 4 +-
> .../cpufreq/nvidia,tegra20-cpufreq.txt | 2 +-
> .../devicetree/bindings/hwmon/gpio-fan.txt | 3 +-
> .../devicetree/bindings/hwmon/lm90.txt | 4 +-
> .../thermal/allwinner,sun8i-a83t-ths.yaml | 2 +-
> .../bindings/thermal/amazon,al-thermal.txt | 2 +-
> .../bindings/thermal/brcm,avs-ro-thermal.yaml | 2 +-
> .../bindings/thermal/brcm,bcm2835-thermal.txt | 2 +-
> .../bindings/thermal/hisilicon-thermal.txt | 2 +-
> .../bindings/thermal/max77620_thermal.txt | 6 +-
> .../bindings/thermal/mediatek-thermal.txt | 2 +-
> .../thermal/nvidia,tegra124-soctherm.txt | 10 +-
> .../thermal/nvidia,tegra186-bpmp-thermal.txt | 2 +-
> .../bindings/thermal/qcom-spmi-temp-alarm.txt | 2 +-
> .../bindings/thermal/rockchip-thermal.txt | 2 +-
> .../bindings/thermal/tango-thermal.txt | 2 +-
> .../bindings/thermal/thermal-generic-adc.txt | 2 +-
> .../devicetree/bindings/thermal/thermal.txt | 586 ------------------
> 24 files changed, 34 insertions(+), 616 deletions(-)
> delete mode 100644 Documentation/devicetree/bindings/thermal/thermal.txt
>
> diff --git a/Documentation/devicetree/bindings/arm/arm,scmi.txt b/Documentation/devicetree/bindings/arm/arm,scmi.txt
> index 1f293ea24cd85..55deb68230ebb 100644
> --- a/Documentation/devicetree/bindings/arm/arm,scmi.txt
> +++ b/Documentation/devicetree/bindings/arm/arm,scmi.txt
> @@ -102,7 +102,7 @@ Required sub-node properties:
> [0] http://infocenter.arm.com/help/topic/com.arm.doc.den0056a/index.html
> [1] Documentation/devicetree/bindings/clock/clock-bindings.txt
> [2] Documentation/devicetree/bindings/power/power-domain.yaml
> -[3] Documentation/devicetree/bindings/thermal/thermal.txt
> +[3] Documentation/devicetree/bindings/thermal/thermal*.yaml
> [4] Documentation/devicetree/bindings/sram/sram.yaml
> [5] Documentation/devicetree/bindings/reset/reset.txt
>
> diff --git a/Documentation/devicetree/bindings/arm/arm,scpi.txt b/Documentation/devicetree/bindings/arm/arm,scpi.txt
> index dd04d9d9a1b8e..bcd6c3ec471e6 100644
> --- a/Documentation/devicetree/bindings/arm/arm,scpi.txt
> +++ b/Documentation/devicetree/bindings/arm/arm,scpi.txt
> @@ -108,7 +108,7 @@ Required properties:
>
> [0] http://infocenter.arm.com/help/topic/com.arm.doc.dui0922b/index.html
> [1] Documentation/devicetree/bindings/clock/clock-bindings.txt
> -[2] Documentation/devicetree/bindings/thermal/thermal.txt
> +[2] Documentation/devicetree/bindings/thermal/thermal*.yaml
> [3] Documentation/devicetree/bindings/sram/sram.yaml
> [4] Documentation/devicetree/bindings/power/power-domain.yaml
>
> diff --git a/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt b/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt
> index 10b8459e49f8c..6064d98b10314 100644
> --- a/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt
> +++ b/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt
> @@ -176,7 +176,7 @@ Required properties:
> "fsl,imx8qxp-sc-thermal"
> followed by "fsl,imx-sc-thermal";
>
> -- #thermal-sensor-cells: See Documentation/devicetree/bindings/thermal/thermal.txt
> +- #thermal-sensor-cells: See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
> for a description.
>
> Example (imx8qxp):
> diff --git a/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt b/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt
> index 098d932fc9630..e31511255d8e3 100644
> --- a/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt
> +++ b/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt
> @@ -111,7 +111,7 @@ Thermal:
> --------
>
> For common binding part and usage, refer to
> -Documentation/devicetree/bindings/thermal/thermal.txt
> +Documentation/devicetree/bindings/thermal/thermal*.yaml
>
> The thermal IP can probe the temperature all around the processor. It
> may feature several channels, each of them wired to one sensor.
> diff --git a/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt b/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt
> index f982a8ed93968..a21f7709596c0 100644
> --- a/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt
> +++ b/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt
> @@ -203,7 +203,7 @@ It is possible to setup an overheat interrupt by giving at least one
> critical point to any subnode of the thermal-zone node.
>
> For common binding part and usage, refer to
> -Documentation/devicetree/bindings/thermal/thermal.txt
> +Documentation/devicetree/bindings/thermal/thermal*.yaml
>
> Required properties:
> - compatible: must be one of:
> diff --git a/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt b/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt
> index 332aed8f4597a..56f4423743838 100644
> --- a/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt
> +++ b/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt
> @@ -18,7 +18,8 @@ Optional properties:
> in unit of nanoseconds.
> - voltage-tolerance: Specify the CPU voltage tolerance in percentage.
> - #cooling-cells:
> - Please refer to Documentation/devicetree/bindings/thermal/thermal.txt.
> + Please refer to
> + Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml.
>
> Examples:
>
> diff --git a/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt b/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt
> index 0551c78619de8..ea4994b35207d 100644
> --- a/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt
> +++ b/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt
> @@ -21,8 +21,8 @@ Optional properties:
> flow is handled by hardware, hence no software "voltage tracking" is
> needed.
> - #cooling-cells:
> - Please refer to Documentation/devicetree/bindings/thermal/thermal.txt
> - for detail.
> + For details, please refer to
> + Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
>
> Example 1 (MT7623 SoC):
>
> diff --git a/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt b/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt
> index daeca6ae6b769..52a24b82fd864 100644
> --- a/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt
> +++ b/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt
> @@ -5,7 +5,7 @@ Required properties:
> - clocks: Must contain an entry for the CPU clock.
> See ../clocks/clock-bindings.txt for details.
> - operating-points-v2: See ../bindings/opp/opp.txt for details.
> -- #cooling-cells: Should be 2. See ../thermal/thermal.txt for details.
> +- #cooling-cells: Should be 2. See ../thermal/thermal-cooling-devices.yaml for details.
>
> For each opp entry in 'operating-points-v2' table:
> - opp-supported-hw: Two bitfields indicating:
> diff --git a/Documentation/devicetree/bindings/hwmon/gpio-fan.txt b/Documentation/devicetree/bindings/hwmon/gpio-fan.txt
> index 2becdcfdc840c..f4cfa350f6a14 100644
> --- a/Documentation/devicetree/bindings/hwmon/gpio-fan.txt
> +++ b/Documentation/devicetree/bindings/hwmon/gpio-fan.txt
> @@ -12,7 +12,8 @@ Optional properties:
> - alarm-gpios: This pin going active indicates something is wrong with
> the fan, and a udev event will be fired.
> - #cooling-cells: If used as a cooling device, must be <2>
> - Also see: Documentation/devicetree/bindings/thermal/thermal.txt
> + Also see:
> + Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
> min and max states are derived from the speed-map of the fan.
>
> Note: At least one the "gpios" or "alarm-gpios" properties must be set.
> diff --git a/Documentation/devicetree/bindings/hwmon/lm90.txt b/Documentation/devicetree/bindings/hwmon/lm90.txt
> index c76a7ac47c342..398dcb9657514 100644
> --- a/Documentation/devicetree/bindings/hwmon/lm90.txt
> +++ b/Documentation/devicetree/bindings/hwmon/lm90.txt
> @@ -34,8 +34,8 @@ Optional properties:
> LM90 "-ALERT" pin output.
> See interrupt-controller/interrupts.txt for the format.
>
> -- #thermal-sensor-cells: should be set to 1. See thermal/thermal.txt for
> - details. See <include/dt-bindings/thermal/lm90.h> for the
> +- #thermal-sensor-cells: should be set to 1. See thermal/thermal-sensor.yaml
> + for details. See <include/dt-bindings/thermal/lm90.h> for the
> definition of the local, remote and 2nd remote sensor index
> constants.
>
> diff --git a/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml b/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml
> index 87369264feb96..44ba6765697d8 100644
> --- a/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml
> +++ b/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml
> @@ -50,7 +50,7 @@ properties:
> nvmem-cell-names:
> const: calibration
>
> - # See ./thermal.txt for details
> + # See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details
> "#thermal-sensor-cells":
> enum:
> - 0
> diff --git a/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt b/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt
> index 703979dbd577d..12fc4ef04837f 100644
> --- a/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt
> +++ b/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt
> @@ -6,7 +6,7 @@ transaction.
> Required properties:
> - compatible: "amazon,al-thermal".
> - reg: The physical base address and length of the sensor's registers.
> -- #thermal-sensor-cells: Must be 1. See ./thermal.txt for a description.
> +- #thermal-sensor-cells: Must be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
>
> Example:
> thermal: thermal {
> diff --git a/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml b/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml
> index f3e68ed03abf8..1ab5070c751d5 100644
> --- a/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml
> +++ b/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml
> @@ -23,7 +23,7 @@ properties:
> compatible:
> const: brcm,bcm2711-thermal
>
> - # See ./thermal.txt for details
> + # See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details
> "#thermal-sensor-cells":
> const: 0
>
> diff --git a/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt b/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt
> index da8c5b73ad105..a3e9ec5dc7ac4 100644
> --- a/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt
> +++ b/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt
> @@ -7,7 +7,7 @@ compatible: should be one of: "brcm,bcm2835-thermal",
> "brcm,bcm2836-thermal" or "brcm,bcm2837-thermal"
> reg: Address range of the thermal registers.
> clocks: Phandle of the clock used by the thermal sensor.
> -#thermal-sensor-cells: should be 0 (see thermal.txt)
> +#thermal-sensor-cells: should be 0 (see Documentation/devicetree/bindings/thermal/thermal-sensor.yaml)
>
> Example:
>
> diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> index cef716a236f1a..4b19d80e6558b 100644
> --- a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> @@ -9,7 +9,7 @@
> by /SOCTHERM/tsensor.
> - clock-names: Input clock name, should be 'thermal_clk'.
> - clocks: phandles for clock specified in "clock-names" property.
> -- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
> +- #thermal-sensor-cells: Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
>
> Example :
>
> diff --git a/Documentation/devicetree/bindings/thermal/max77620_thermal.txt b/Documentation/devicetree/bindings/thermal/max77620_thermal.txt
> index 323a3b3822aac..82ed5d4879666 100644
> --- a/Documentation/devicetree/bindings/thermal/max77620_thermal.txt
> +++ b/Documentation/devicetree/bindings/thermal/max77620_thermal.txt
> @@ -8,12 +8,12 @@ below threshold level.
>
> Required properties:
> -------------------
> -#thermal-sensor-cells: Please refer <devicetree/bindings/thermal/thermal.txt>
> - for more details.
> +#thermal-sensor-cells: For more details, please refer to
> + <devicetree/bindings/thermal/thermal-sensor.yaml>
> The value must be 0.
>
> For more details, please refer generic thermal DT binding document
> -<devicetree/bindings/thermal/thermal.txt>.
> +<devicetree/bindings/thermal/thermal*.yaml>.
>
> Please refer <devicetree/bindings/mfd/max77620.txt> for mfd DT binding
> document for the MAX77620.
> diff --git a/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt b/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt
> index f8d7831f39740..1e249c42fae04 100644
> --- a/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt
> +++ b/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt
> @@ -23,7 +23,7 @@ Required properties:
> - resets: Reference to the reset controller controlling the thermal controller.
> - mediatek,auxadc: A phandle to the AUXADC which the thermal controller uses
> - mediatek,apmixedsys: A phandle to the APMIXEDSYS controller.
> -- #thermal-sensor-cells : Should be 0. See ./thermal.txt for a description.
> +- #thermal-sensor-cells : Should be 0. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
>
> Optional properties:
> - nvmem-cells: A phandle to the calibration data provided by a nvmem device. If
> diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt
> index f02f38527a6b6..db880e7ed713e 100644
> --- a/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt
> +++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt
> @@ -28,9 +28,10 @@ Required properties :
> See ../reset/reset.txt for details.
> - reset-names : Must include the following entries:
> - soctherm
> -- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description
> - of this property. See <dt-bindings/thermal/tegra124-soctherm.h> for a
> - list of valid values when referring to thermal sensors.
> +- #thermal-sensor-cells : Should be 1. For a description of this property, see
> + Documentation/devicetree/bindings/thermal/thermal-sensor.yaml.
> + See <dt-bindings/thermal/tegra124-soctherm.h> for a list of valid values
> + when referring to thermal sensors.
> - throttle-cfgs: A sub-node which is a container of configuration for each
> hardware throttle events. These events can be set as cooling devices.
> * throttle events: Sub-nodes must be named as "light" or "heavy".
> @@ -62,7 +63,8 @@ Required properties :
> TEGRA_SOCTHERM_THROT_LEVEL_MED (75%),
> TEGRA_SOCTHERM_THROT_LEVEL_HIGH (85%).
> - #cooling-cells: Should be 1. This cooling device only support on/off state.
> - See ./thermal.txt for a description of this property.
> + For a description of this property see:
> + Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
>
> Optional properties: The following properties are T210 specific and
> valid only for OCx throttle events.
> diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt b/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt
> index e17c07be270b7..fc87f6aa1b8f5 100644
> --- a/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt
> +++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt
> @@ -8,7 +8,7 @@ exposed by BPMP.
> The BPMP thermal node must be located directly inside the main BPMP node. See
> ../firmware/nvidia,tegra186-bpmp.txt for details of the BPMP binding.
>
> -This node represents a thermal sensor. See thermal.txt for details of the
> +This node represents a thermal sensor. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details of the
> core thermal binding.
>
> Required properties:
> diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
> index 0273a92a2a849..2d5b2ad03314b 100644
> --- a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
> +++ b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
> @@ -8,7 +8,7 @@ Required properties:
> - compatible: Should contain "qcom,spmi-temp-alarm".
> - reg: Specifies the SPMI address.
> - interrupts: PMIC temperature alarm interrupt.
> -- #thermal-sensor-cells: Should be 0. See thermal.txt for a description.
> +- #thermal-sensor-cells: Should be 0. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
>
> Optional properties:
> - io-channels: Should contain IIO channel specifier for the ADC channel,
> diff --git a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
> index c6aac9bcacf1c..7f94669e9ebef 100644
> --- a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
> +++ b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
> @@ -24,7 +24,7 @@ Required properties:
> - pinctrl-1 : The "default" pinctrl state, it will be set after reset the
> TSADC controller.
> - pinctrl-2 : The "sleep" pinctrl state, it will be in for suspend.
> -- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description.
> +- #thermal-sensor-cells : Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
>
> Optional properties:
> - rockchip,hw-tshut-temp : The hardware-controlled shutdown temperature value.
> diff --git a/Documentation/devicetree/bindings/thermal/tango-thermal.txt b/Documentation/devicetree/bindings/thermal/tango-thermal.txt
> index 212198d4b9379..2c918d742867a 100644
> --- a/Documentation/devicetree/bindings/thermal/tango-thermal.txt
> +++ b/Documentation/devicetree/bindings/thermal/tango-thermal.txt
> @@ -4,7 +4,7 @@ The SMP8758 SoC includes 3 instances of this temperature sensor
> (in the CPU, video decoder, and PCIe controller).
>
> Required properties:
> -- #thermal-sensor-cells: Should be 0 (see thermal.txt)
> +- #thermal-sensor-cells: Should be 0 (see Documentation/devicetree/bindings/thermal/thermal-sensor.yaml)
> - compatible: "sigma,smp8758-thermal"
> - reg: Address range of the thermal registers
>
> diff --git a/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt
> index 691a09db2fefc..e136946a2f4fd 100644
> --- a/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt
> +++ b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt
> @@ -8,7 +8,7 @@ temperature using voltage-temperature lookup table.
> Required properties:
> ===================
> - compatible: Must be "generic-adc-thermal".
> -- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description
> +- #thermal-sensor-cells: Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description
> of this property.
> Optional properties:
> ===================
> diff --git a/Documentation/devicetree/bindings/thermal/thermal.txt b/Documentation/devicetree/bindings/thermal/thermal.txt
> deleted file mode 100644
> index f78bec19ca358..0000000000000
> --- a/Documentation/devicetree/bindings/thermal/thermal.txt
> +++ /dev/null
> @@ -1,586 +0,0 @@
> -* Thermal Framework Device Tree descriptor
> -
> -This file describes a generic binding to provide a way of
> -defining hardware thermal structure using device tree.
> -A thermal structure includes thermal zones and their components,
> -such as trip points, polling intervals, sensors and cooling devices
> -binding descriptors.
> -
> -The target of device tree thermal descriptors is to describe only
> -the hardware thermal aspects. The thermal device tree bindings are
> -not about how the system must control or which algorithm or policy
> -must be taken in place.
> -
> -There are five types of nodes involved to describe thermal bindings:
> -- thermal sensors: devices which may be used to take temperature
> - measurements.
> -- cooling devices: devices which may be used to dissipate heat.
> -- trip points: describe key temperatures at which cooling is recommended. The
> - set of points should be chosen based on hardware limits.
> -- cooling maps: used to describe links between trip points and cooling devices;
> -- thermal zones: used to describe thermal data within the hardware;
> -
> -The following is a description of each of these node types.
> -
> -* Thermal sensor devices
> -
> -Thermal sensor devices are nodes providing temperature sensing capabilities on
> -thermal zones. Typical devices are I2C ADC converters and bandgaps. These are
> -nodes providing temperature data to thermal zones. Thermal sensor devices may
> -control one or more internal sensors.
> -
> -Required property:
> -- #thermal-sensor-cells: Used to provide sensor device specific information
> - Type: unsigned while referring to it. Typically 0 on thermal sensor
> - Size: one cell nodes with only one sensor, and at least 1 on nodes
> - with several internal sensors, in order
> - to identify uniquely the sensor instances within
> - the IC. See thermal zone binding for more details
> - on how consumers refer to sensor devices.
> -
> -* Cooling device nodes
> -
> -Cooling devices are nodes providing control on power dissipation. There
> -are essentially two ways to provide control on power dissipation. First
> -is by means of regulating device performance, which is known as passive
> -cooling. A typical passive cooling is a CPU that has dynamic voltage and
> -frequency scaling (DVFS), and uses lower frequencies as cooling states.
> -Second is by means of activating devices in order to remove
> -the dissipated heat, which is known as active cooling, e.g. regulating
> -fan speeds. In both cases, cooling devices shall have a way to determine
> -the state of cooling in which the device is.
> -
> -Any cooling device has a range of cooling states (i.e. different levels
> -of heat dissipation). For example a fan's cooling states correspond to
> -the different fan speeds possible. Cooling states are referred to by
> -single unsigned integers, where larger numbers mean greater heat
> -dissipation. The precise set of cooling states associated with a device
> -should be defined in a particular device's binding.
> -For more examples of cooling devices, refer to the example sections below.
> -
> -Required properties:
> -- #cooling-cells: Used to provide cooling device specific information
> - Type: unsigned while referring to it. Must be at least 2, in order
> - Size: one cell to specify minimum and maximum cooling state used
> - in the reference. The first cell is the minimum
> - cooling state requested and the second cell is
> - the maximum cooling state requested in the reference.
> - See Cooling device maps section below for more details
> - on how consumers refer to cooling devices.
> -
> -* Trip points
> -
> -The trip node is a node to describe a point in the temperature domain
> -in which the system takes an action. This node describes just the point,
> -not the action.
> -
> -Required properties:
> -- temperature: An integer indicating the trip temperature level,
> - Type: signed in millicelsius.
> - Size: one cell
> -
> -- hysteresis: A low hysteresis value on temperature property (above).
> - Type: unsigned This is a relative value, in millicelsius.
> - Size: one cell
> -
> -- type: a string containing the trip type. Expected values are:
> - "active": A trip point to enable active cooling
> - "passive": A trip point to enable passive cooling
> - "hot": A trip point to notify emergency
> - "critical": Hardware not reliable.
> - Type: string
> -
> -* Cooling device maps
> -
> -The cooling device maps node is a node to describe how cooling devices
> -get assigned to trip points of the zone. The cooling devices are expected
> -to be loaded in the target system.
> -
> -Required properties:
> -- cooling-device: A list of phandles of cooling devices with their specifiers,
> - Type: phandle + referring to which cooling devices are used in this
> - cooling specifier binding. In the cooling specifier, the first cell
> - is the minimum cooling state and the second cell
> - is the maximum cooling state used in this map.
> -- trip: A phandle of a trip point node within the same thermal
> - Type: phandle of zone.
> - trip point node
> -
> -Optional property:
> -- contribution: The cooling contribution to the thermal zone of the
> - Type: unsigned referred cooling device at the referred trip point.
> - Size: one cell The contribution is a ratio of the sum
> - of all cooling contributions within a thermal zone.
> -
> -Note: Using the THERMAL_NO_LIMIT (-1UL) constant in the cooling-device phandle
> -limit specifier means:
> -(i) - minimum state allowed for minimum cooling state used in the reference.
> -(ii) - maximum state allowed for maximum cooling state used in the reference.
> -Refer to include/dt-bindings/thermal/thermal.h for definition of this constant.
> -
> -* Thermal zone nodes
> -
> -The thermal zone node is the node containing all the required info
> -for describing a thermal zone, including its cooling device bindings. The
> -thermal zone node must contain, apart from its own properties, one sub-node
> -containing trip nodes and one sub-node containing all the zone cooling maps.
> -
> -Required properties:
> -- polling-delay: The maximum number of milliseconds to wait between polls
> - Type: unsigned when checking this thermal zone.
> - Size: one cell
> -
> -- polling-delay-passive: The maximum number of milliseconds to wait
> - Type: unsigned between polls when performing passive cooling.
> - Size: one cell
> -
> -- thermal-sensors: A list of thermal sensor phandles and sensor specifier
> - Type: list of used while monitoring the thermal zone.
> - phandles + sensor
> - specifier
> -
> -- trips: A sub-node which is a container of only trip point nodes
> - Type: sub-node required to describe the thermal zone.
> -
> -Optional property:
> -- cooling-maps: A sub-node which is a container of only cooling device
> - Type: sub-node map nodes, used to describe the relation between trips
> - and cooling devices.
> -
> -- coefficients: An array of integers (one signed cell) containing
> - Type: array coefficients to compose a linear relation between
> - Elem size: one cell the sensors listed in the thermal-sensors property.
> - Elem type: signed Coefficients defaults to 1, in case this property
> - is not specified. A simple linear polynomial is used:
> - Z = c0 * x0 + c1 * x1 + ... + c(n-1) * x(n-1) + cn.
> -
> - The coefficients are ordered and they match with sensors
> - by means of sensor ID. Additional coefficients are
> - interpreted as constant offset.
> -
> -- sustainable-power: An estimate of the sustainable power (in mW) that the
> - Type: unsigned thermal zone can dissipate at the desired
> - Size: one cell control temperature. For reference, the
> - sustainable power of a 4'' phone is typically
> - 2000mW, while on a 10'' tablet is around
> - 4500mW.
> -
> -Note: The delay properties are bound to the maximum dT/dt (temperature
> -derivative over time) in two situations for a thermal zone:
> -(i) - when passive cooling is activated (polling-delay-passive); and
> -(ii) - when the zone just needs to be monitored (polling-delay) or
> -when active cooling is activated.
> -
> -The maximum dT/dt is highly bound to hardware power consumption and dissipation
> -capability. The delays should be chosen to account for said max dT/dt,
> -such that a device does not cross several trip boundaries unexpectedly
> -between polls. Choosing the right polling delays shall avoid having the
> -device in temperature ranges that may damage the silicon structures and
> -reduce silicon lifetime.
> -
> -* The thermal-zones node
> -
> -The "thermal-zones" node is a container for all thermal zone nodes. It shall
> -contain only sub-nodes describing thermal zones as in the section
> -"Thermal zone nodes". The "thermal-zones" node appears under "/".
> -
> -* Examples
> -
> -Below are several examples on how to use thermal data descriptors
> -using device tree bindings:
> -
> -(a) - CPU thermal zone
> -
> -The CPU thermal zone example below describes how to setup one thermal zone
> -using one single sensor as temperature source and many cooling devices and
> -power dissipation control sources.
> -
> -#include <dt-bindings/thermal/thermal.h>
> -
> -cpus {
> - /*
> - * Here is an example of describing a cooling device for a DVFS
> - * capable CPU. The CPU node describes its four OPPs.
> - * The cooling states possible are 0..3, and they are
> - * used as OPP indexes. The minimum cooling state is 0, which means
> - * all four OPPs can be available to the system. The maximum
> - * cooling state is 3, which means only the lowest OPPs (198MHz at 0.85V)
> - * can be available in the system.
> - */
> - cpu0: cpu at 0 {
> - ...
> - operating-points = <
> - /* kHz uV */
> - 970000 1200000
> - 792000 1100000
> - 396000 950000
> - 198000 850000
> - >;
> - #cooling-cells = <2>; /* min followed by max */
> - };
> - ...
> -};
> -
> -&i2c1 {
> - ...
> - /*
> - * A simple fan controller which supports 10 speeds of operation
> - * (represented as 0-9).
> - */
> - fan0: fan at 48 {
> - ...
> - #cooling-cells = <2>; /* min followed by max */
> - };
> -};
> -
> -ocp {
> - ...
> - /*
> - * A simple IC with a single bandgap temperature sensor.
> - */
> - bandgap0: bandgap at 0000ed00 {
> - ...
> - #thermal-sensor-cells = <0>;
> - };
> -};
> -
> -thermal-zones {
> - cpu_thermal: cpu-thermal {
> - polling-delay-passive = <250>; /* milliseconds */
> - polling-delay = <1000>; /* milliseconds */
> -
> - thermal-sensors = <&bandgap0>;
> -
> - trips {
> - cpu_alert0: cpu-alert0 {
> - temperature = <90000>; /* millicelsius */
> - hysteresis = <2000>; /* millicelsius */
> - type = "active";
> - };
> - cpu_alert1: cpu-alert1 {
> - temperature = <100000>; /* millicelsius */
> - hysteresis = <2000>; /* millicelsius */
> - type = "passive";
> - };
> - cpu_crit: cpu-crit {
> - temperature = <125000>; /* millicelsius */
> - hysteresis = <2000>; /* millicelsius */
> - type = "critical";
> - };
> - };
> -
> - cooling-maps {
> - map0 {
> - trip = <&cpu_alert0>;
> - cooling-device = <&fan0 THERMAL_NO_LIMIT 4>;
> - };
> - map1 {
> - trip = <&cpu_alert1>;
> - cooling-device = <&fan0 5 THERMAL_NO_LIMIT>, <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> - };
> - };
> - };
> -};
> -
> -In the example above, the ADC sensor (bandgap0) at address 0x0000ED00 is
> -used to monitor the zone 'cpu-thermal' using its sole sensor. A fan
> -device (fan0) is controlled via I2C bus 1, at address 0x48, and has ten
> -different cooling states 0-9. It is used to remove the heat out of
> -the thermal zone 'cpu-thermal' using its cooling states
> -from its minimum to 4, when it reaches trip point 'cpu_alert0'
> -at 90C, as an example of active cooling. The same cooling device is used at
> -'cpu_alert1', but from 5 to its maximum state. The cpu at 0 device is also
> -linked to the same thermal zone, 'cpu-thermal', as a passive cooling device,
> -using all its cooling states at trip point 'cpu_alert1',
> -which is a trip point at 100C. On the thermal zone 'cpu-thermal', at the
> -temperature of 125C, represented by the trip point 'cpu_crit', the silicon
> -is not reliable anymore.
> -
> -(b) - IC with several internal sensors
> -
> -The example below describes how to deploy several thermal zones based off a
> -single sensor IC, assuming it has several internal sensors. This is a common
> -case on SoC designs with several internal IPs that may need different thermal
> -requirements, and thus may have their own sensor to monitor or detect internal
> -hotspots in their silicon.
> -
> -#include <dt-bindings/thermal/thermal.h>
> -
> -ocp {
> - ...
> - /*
> - * A simple IC with several bandgap temperature sensors.
> - */
> - bandgap0: bandgap at 0000ed00 {
> - ...
> - #thermal-sensor-cells = <1>;
> - };
> -};
> -
> -thermal-zones {
> - cpu_thermal: cpu-thermal {
> - polling-delay-passive = <250>; /* milliseconds */
> - polling-delay = <1000>; /* milliseconds */
> -
> - /* sensor ID */
> - thermal-sensors = <&bandgap0 0>;
> -
> - trips {
> - /* each zone within the SoC may have its own trips */
> - cpu_alert: cpu-alert {
> - temperature = <100000>; /* millicelsius */
> - hysteresis = <2000>; /* millicelsius */
> - type = "passive";
> - };
> - cpu_crit: cpu-crit {
> - temperature = <125000>; /* millicelsius */
> - hysteresis = <2000>; /* millicelsius */
> - type = "critical";
> - };
> - };
> -
> - cooling-maps {
> - /* each zone within the SoC may have its own cooling */
> - ...
> - };
> - };
> -
> - gpu_thermal: gpu-thermal {
> - polling-delay-passive = <120>; /* milliseconds */
> - polling-delay = <1000>; /* milliseconds */
> -
> - /* sensor ID */
> - thermal-sensors = <&bandgap0 1>;
> -
> - trips {
> - /* each zone within the SoC may have its own trips */
> - gpu_alert: gpu-alert {
> - temperature = <90000>; /* millicelsius */
> - hysteresis = <2000>; /* millicelsius */
> - type = "passive";
> - };
> - gpu_crit: gpu-crit {
> - temperature = <105000>; /* millicelsius */
> - hysteresis = <2000>; /* millicelsius */
> - type = "critical";
> - };
> - };
> -
> - cooling-maps {
> - /* each zone within the SoC may have its own cooling */
> - ...
> - };
> - };
> -
> - dsp_thermal: dsp-thermal {
> - polling-delay-passive = <50>; /* milliseconds */
> - polling-delay = <1000>; /* milliseconds */
> -
> - /* sensor ID */
> - thermal-sensors = <&bandgap0 2>;
> -
> - trips {
> - /* each zone within the SoC may have its own trips */
> - dsp_alert: dsp-alert {
> - temperature = <90000>; /* millicelsius */
> - hysteresis = <2000>; /* millicelsius */
> - type = "passive";
> - };
> - dsp_crit: gpu-crit {
> - temperature = <135000>; /* millicelsius */
> - hysteresis = <2000>; /* millicelsius */
> - type = "critical";
> - };
> - };
> -
> - cooling-maps {
> - /* each zone within the SoC may have its own cooling */
> - ...
> - };
> - };
> -};
> -
> -In the example above, there is one bandgap IC which has the capability to
> -monitor three sensors. The hardware has been designed so that sensors are
> -placed on different places in the DIE to monitor different temperature
> -hotspots: one for CPU thermal zone, one for GPU thermal zone and the
> -other to monitor a DSP thermal zone.
> -
> -Thus, there is a need to assign each sensor provided by the bandgap IC
> -to different thermal zones. This is achieved by means of using the
> -#thermal-sensor-cells property and using the first cell of the sensor
> -specifier as sensor ID. In the example, then, <bandgap 0> is used to
> -monitor CPU thermal zone, <bandgap 1> is used to monitor GPU thermal
> -zone and <bandgap 2> is used to monitor DSP thermal zone. Each zone
> -may be uncorrelated, having its own dT/dt requirements, trips
> -and cooling maps.
> -
> -
> -(c) - Several sensors within one single thermal zone
> -
> -The example below illustrates how to use more than one sensor within
> -one thermal zone.
> -
> -#include <dt-bindings/thermal/thermal.h>
> -
> -&i2c1 {
> - ...
> - /*
> - * A simple IC with a single temperature sensor.
> - */
> - adc: sensor at 49 {
> - ...
> - #thermal-sensor-cells = <0>;
> - };
> -};
> -
> -ocp {
> - ...
> - /*
> - * A simple IC with a single bandgap temperature sensor.
> - */
> - bandgap0: bandgap at 0000ed00 {
> - ...
> - #thermal-sensor-cells = <0>;
> - };
> -};
> -
> -thermal-zones {
> - cpu_thermal: cpu-thermal {
> - polling-delay-passive = <250>; /* milliseconds */
> - polling-delay = <1000>; /* milliseconds */
> -
> - thermal-sensors = <&bandgap0>, /* cpu */
> - <&adc>; /* pcb north */
> -
> - /* hotspot = 100 * bandgap - 120 * adc + 484 */
> - coefficients = <100 -120 484>;
> -
> - trips {
> - ...
> - };
> -
> - cooling-maps {
> - ...
> - };
> - };
> -};
> -
> -In some cases, there is a need to use more than one sensor to extrapolate
> -a thermal hotspot in the silicon. The above example illustrates this situation.
> -For instance, it may be the case that a sensor external to CPU IP may be placed
> -close to CPU hotspot and together with internal CPU sensor, it is used
> -to determine the hotspot. Assuming this is the case for the above example,
> -the hypothetical extrapolation rule would be:
> - hotspot = 100 * bandgap - 120 * adc + 484
> -
> -In other context, the same idea can be used to add fixed offset. For instance,
> -consider the hotspot extrapolation rule below:
> - hotspot = 1 * adc + 6000
> -
> -In the above equation, the hotspot is always 6C higher than what is read
> -from the ADC sensor. The binding would be then:
> - thermal-sensors = <&adc>;
> -
> - /* hotspot = 1 * adc + 6000 */
> - coefficients = <1 6000>;
> -
> -(d) - Board thermal
> -
> -The board thermal example below illustrates how to setup one thermal zone
> -with many sensors and many cooling devices.
> -
> -#include <dt-bindings/thermal/thermal.h>
> -
> -&i2c1 {
> - ...
> - /*
> - * An IC with several temperature sensor.
> - */
> - adc_dummy: sensor at 50 {
> - ...
> - #thermal-sensor-cells = <1>; /* sensor internal ID */
> - };
> -};
> -
> -thermal-zones {
> - batt-thermal {
> - polling-delay-passive = <500>; /* milliseconds */
> - polling-delay = <2500>; /* milliseconds */
> -
> - /* sensor ID */
> - thermal-sensors = <&adc_dummy 4>;
> -
> - trips {
> - ...
> - };
> -
> - cooling-maps {
> - ...
> - };
> - };
> -
> - board_thermal: board-thermal {
> - polling-delay-passive = <1000>; /* milliseconds */
> - polling-delay = <2500>; /* milliseconds */
> -
> - /* sensor ID */
> - thermal-sensors = <&adc_dummy 0>, /* pcb top edge */
> - <&adc_dummy 1>, /* lcd */
> - <&adc_dummy 2>; /* back cover */
> - /*
> - * An array of coefficients describing the sensor
> - * linear relation. E.g.:
> - * z = c1*x1 + c2*x2 + c3*x3
> - */
> - coefficients = <1200 -345 890>;
> -
> - sustainable-power = <2500>;
> -
> - trips {
> - /* Trips are based on resulting linear equation */
> - cpu_trip: cpu-trip {
> - temperature = <60000>; /* millicelsius */
> - hysteresis = <2000>; /* millicelsius */
> - type = "passive";
> - };
> - gpu_trip: gpu-trip {
> - temperature = <55000>; /* millicelsius */
> - hysteresis = <2000>; /* millicelsius */
> - type = "passive";
> - }
> - lcd_trip: lcp-trip {
> - temperature = <53000>; /* millicelsius */
> - hysteresis = <2000>; /* millicelsius */
> - type = "passive";
> - };
> - crit_trip: crit-trip {
> - temperature = <68000>; /* millicelsius */
> - hysteresis = <2000>; /* millicelsius */
> - type = "critical";
> - };
> - };
> -
> - cooling-maps {
> - map0 {
> - trip = <&cpu_trip>;
> - cooling-device = <&cpu0 0 2>;
> - contribution = <55>;
> - };
> - map1 {
> - trip = <&gpu_trip>;
> - cooling-device = <&gpu0 0 2>;
> - contribution = <20>;
> - };
> - map2 {
> - trip = <&lcd_trip>;
> - cooling-device = <&lcd0 5 10>;
> - contribution = <15>;
> - };
> - };
> - };
> -};
> -
> -The above example is a mix of previous examples, a sensor IP with several internal
> -sensors used to monitor different zones, one of them is composed by several sensors and
> -with different cooling devices.
> --
> 2.25.1
>
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