[PATCH v3 2/6] dt-bindings: riscv: microchip: document icicle kit with production device

[Krzysztof Kozlowski]

On Mon, Sep 08, 2025 at 12:57:28PM +0100, Valentina Fernandez wrote:
> With the introduction of the Icicle Kit using the production MPFS250T
> device, it's necessary to distinguish it from the engineering sample
> (-es) variant. Engineering samples cannot write to flash from the MSS,
> as noted in the PolarFire SoC FPGA ES errata.
> 
> Add specific compatibles for the Icicle Kit with Production device
> (MPFS250T) and Icicle Kit with Engineering Sample (MPFS250T_ES).
> 
> The icicle kit reference designs in the v2025.07 release include the
> Mi-V IHC IP v2, used to send/receive data between clusters when
> using Asymmetric Multiprocessing (AMP) mode.
> 
> In reference design releases prior to v2025.07, the MI-V IHC subsystem
> was included as a proof of concept in the design prior to becoming an
> IP available in the Libero catalog.
> 
> Among other improvements, the new Mi-V IHC IP v2 includes some
> changes to the register map. For this reason, make use of a new
> reference design compatible to denote that v2025.07 reference design
> releases are not backwards compatible.
> 
> Signed-off-by: Valentina Fernandez <valentina.fernandezalanis at microchip.com>
> ---
>  Documentation/devicetree/bindings/riscv/microchip.yaml | 8 ++++++++
>  1 file changed, 8 insertions(+)

Why are you sending patches which are already applied? For two weeks?

Best regards,
Krzysztof