[PATCH 03/10] dt-bindings: vendor-prefixes: add eswin

[Conor Dooley]

On Tue, Mar 11, 2025 at 01:04:25PM +0530, Pinkesh Vaghela wrote:
> From: Pritesh Patel <pritesh.patel at einfochips.com>
> 
> Add new vendor string to dt bindings.
> This new vendor string is used by
> - ESWIN EIC770X SoC
> - HiFive Premier P550 board which uses EIC7700 SoC.
> 
> Link: https://www.eswin.com/en/
> Signed-off-by: Pritesh Patel <pritesh.patel at einfochips.com>
> Reviewed-by: Samuel Holland <samuel.holland at sifive.com>
> Signed-off-by: Pinkesh Vaghela <pinkesh.vaghela at einfochips.com>

Acked-by: Conor Dooley <conor.dooley at microchip.com>

> ---
>  Documentation/devicetree/bindings/vendor-prefixes.yaml | 2 ++
>  1 file changed, 2 insertions(+)
> 
> diff --git a/Documentation/devicetree/bindings/vendor-prefixes.yaml b/Documentation/devicetree/bindings/vendor-prefixes.yaml
> index 5079ca6ce1d1..07ff140e67dc 100644
> --- a/Documentation/devicetree/bindings/vendor-prefixes.yaml
> +++ b/Documentation/devicetree/bindings/vendor-prefixes.yaml
> @@ -490,6 +490,8 @@ patternProperties:
>      description: Espressif Systems Co. Ltd.
>    "^est,.*":
>      description: ESTeem Wireless Modems
> +  "^eswin,.*":
> +    description: Beijing ESWIN Technology Group Co. Ltd.
>    "^ettus,.*":
>      description: NI Ettus Research
>    "^eukrea,.*":
> -- 
> 2.25.1
> 
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