[PATCH v3 1/5] dt-bindings: arm: qcom: Document Shikra and its EVK boards

Komal Bajaj komal.bajaj at oss.qualcomm.com
Wed May 27 07:09:13 PDT 2026


On 5/27/2026 2:25 PM, Krzysztof Kozlowski wrote:
> On Wed, May 27, 2026 at 12:42:20PM +0530, Komal Bajaj wrote:
>> On 5/26/2026 9:15 PM, Krzysztof Kozlowski wrote:
>>> On Fri, May 22, 2026 at 11:32:24PM +0530, Komal Bajaj wrote:
>>>> Shikra is a Qualcomm IoT SoC available in a System-on-Module (SoM)
>>>> form factor. The SoM integrates the Shikra SoC, PMICs, and essential
>>>> passives, and is designed to be mounted on carrier boards.
>>>>
>>>> Three eSoM variant are introduced:
>>>>     - CQM: retail variant with integrated modem
>>>>     - CQS: retail variant without modem
>>>>     - IQS: industrial-grade variant without modem
>>> Industrial/consumer variants differ often only with thermal, so how is
>>> it here? Thermal difference does not make them incompatible. Honestly,
>>> usually industrial one does not even receive dedicated compatibles.
>> The IQS variant uses a PM8150 PMIC, while CQS/CQM use PM4125 + PM8005. These
>
> This should be part of commit msg. You explained WHAT you did, not WHY.
> We see the diff and we see you added cqm, cqs and iqs...

Sure, I will add PMIC details in commit message.

>
> Also:
> Please wrap commit message according to Linux coding style / submission
> process (neither too early nor over the limit):
> https://elixir.bootlin.com/linux/v6.4-rc1/source/Documentation/process/submitting-patches.rst#L597

Will take care in next revision.

Thanks
Komal

>
> Best regards,
> Krzysztof
>




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