[PATCH 2/2] mtd: spinand: winbond: add support for W25N01KW and W25N02LW

[Md Sadre Alam]

On Fri, Aug 07, 2026 at 03:50:42PM +0200, Miquel Raynal wrote:
> Hi Sadre,
> 
> On 07/08/2026 at 12:13:39 +0530, Md Sadre Alam <md.alam at oss.qualcomm.com> wrote:
> 
> > Add support for the Winbond W25N01KW and W25N02LW SPI-NAND
> > devices.
> >
> > The W25N01KW shares the same geometry, OOB layout, and ECC
> > status handling as the existing W25N01KV, while the W25N02LW
> > matches the existing W25N02KV/W25N02KW devices and reuses
> > their OOB layout and ECC status callback.
> >
> > Signed-off-by: Md Sadre Alam <md.alam at oss.qualcomm.com>
> > ---
> 
> Sashiko raises a point:
> 
> - [Medium] The device ID `0x12, 0x22` for W25N02LW breaks the
> established pattern for Winbond 1.8V SPI NAND devices and is highly
> likely a typo for `0xb2, 0x22`.
> 
> Can you please check?

I checked the W25N02LW datasheet, section 8.1.1 "Manufacturer and Device
Identification". It lists the W25N02LW Device ID as 1222h.

Thanks,
Alam.