[PATCH v5 6/6] mtd: spi-nor: spansion: Add s25hl-t/s25hs-t IDs and fixups

[Vignesh Raghavendra]

On 4/27/21 12:39 PM, tkuw584924 at gmail.com wrote:
> From: Takahiro Kuwano <Takahiro.Kuwano at infineon.com>
> 
> The S25HL-T/S25HS-T family is the Cypress Semper Flash with Quad SPI.
> 
> For the single-die package parts (512Mb and 1Gb), only bottom 4KB and
> uniform sector sizes are supported. For the multi-die package parts (2Gb),
> only uniform sector sizes is supprted. This is due to missing or incorrect
> entries in SMPT. Fixup for other sector sizes configurations will be
> followed up as needed.
> 
> Tested on Xilinx Zynq-7000 FPGA board.
> 
> Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano at infineon.com>
> Reviewed-by: Pratyush Yadav <p.yadav at ti.com>
> ---
> Changes in v5:
>   - Add NO_CHIP_ERASE flag to S25HL02GT and S25HS02GT
> 
> Changes in v4:
>   - Merge block comments about SMPT in s25hx_t_post_sfdp_fixups()
>   - Remove USE_CLSR flags from S25HL02GT and S25HS02GT
> 
> Changes in v3:
>   - Remove S25HL256T and S25HS256T
>   - Add S25HL02GT and S25HS02GT 
>   - Add support for multi-die package parts support
>   - Remove erase_map fix for top/split sector layout
>   - Set ECC data unit size (16B) to writesize 
> 
>  drivers/mtd/spi-nor/spansion.c | 117 +++++++++++++++++++++++++++++++++
>  1 file changed, 117 insertions(+)
> 
> diff --git a/drivers/mtd/spi-nor/spansion.c b/drivers/mtd/spi-nor/spansion.c
> index 79d3249ed0aa..b3b006874b4f 100644
> --- a/drivers/mtd/spi-nor/spansion.c
> +++ b/drivers/mtd/spi-nor/spansion.c
> @@ -229,6 +229,103 @@ static int spansion_mdp_ready(struct spi_nor *nor, u8 reg_dummy, u32 die_size)
>  	return 1;
>  }
>  
> +static int s25hx_t_quad_enable(struct spi_nor *nor)
> +{
> +	return spansion_quad_enable_volatile(nor, 0, SZ_128M);

Number of dies should be part of struct flash_info
Die size can then be derived from total_size / die_num


> +}
> +
> +static int s25hx_t_mdp_ready(struct spi_nor *nor)
> +{
> +	return spansion_mdp_ready(nor, 0, SZ_128M);

Hmm, is it necessary to poll second die if writes/erases were targeted
to first die only?

Please split multi die support into a separate series. SPI NOR core
should be aware of multiple dies and thus call poll on each of the dies
separately.

This will also allow base S25hx support to be accepted faster.

> +}
> +
> +static int
> +s25hx_t_post_bfpt_fixups(struct spi_nor *nor,
> +			 const struct sfdp_parameter_header *bfpt_header,
> +			 const struct sfdp_bfpt *bfpt,
> +			 struct spi_nor_flash_parameter *params)
> +{
> +	int ret;
> +	u32 addr;
> +	u8 cfr3v;
> +
> +	ret = spi_nor_set_4byte_addr_mode(nor, true);
> +	if (ret)
> +		return ret;
> +	nor->addr_width = 4;

Don't we need to check if flash size is actual >16M before enabling 4
byte addressing?

> +
> +	/* Replace Quad Enable with volatile version */
> +	params->quad_enable = s25hx_t_quad_enable;
> +
> +	/*
> +	 * The page_size is set to 512B from BFPT, but it actually depends on
> +	 * the configuration register. Look up the CFR3V and determine the
> +	 * page_size. For multi-die package parts, use 512B only when the all
> +	 * dies are configured to 512B buffer.
> +	 */
> +	for (addr = 0; addr < params->size; addr += SZ_128M) {
> +		ret = spansion_read_any_reg(nor,
> +					    addr + SPINOR_REG_CYPRESS_CFR3V, 0,
> +					    &cfr3v);
> +		if (ret)
> +			return ret;
> +
> +		if (!(cfr3v & SPINOR_REG_CYPRESS_CFR3V_PGSZ)) {
> +			params->page_size = 256;
> +			return 0;
> +		}
> +	}
> +	params->page_size = 512;
> +
> +	return 0;
> +}
> +
Regards
Vignesh