[PATCH v1 0/3] mtd: add support for the dual-die stack parallel NOR
Bean Huo
beanhuo at outlook.com
Wed Feb 21 11:32:29 PST 2018
From: beanhuo <beanhuo at micron.com>
The dual-die stacked parallel NOR flash comprises the two identical dies
in parallel. the second/upper die should be selected through its unlock
cycle command addresses, maximum address line A[max]. when the
A[max] == 1, the second/upper die is activated, when A[max] == 0, the
first/lower die is activated.
Because CFI table doesn't exist one entry that can tell us this is a dual
die device, I only add this information in the devicetree binding.
This patch now will update following funcitons:
otp_enter()
otp_exit()
do_write_oneword()
do_write_buffer()
do_panic_write_oneword()
do_erase_oneblock()
do_ppb_xxlock()
For the Micron dual-die stacked PNOR,since there are two dies now,
the following functions need to be changed, but not in this series
patch. Because I am not 100% sure if other parallel NOR vendors'
dual-die stacked PNOR need, still studying.
do_otp_lock()
cfi_amdstd_otp_walk()
do_erase_chip()
beanhuo (3):
mtd: physmap: add dual die entry in devicetree binding
mtd: probe: probe dual die entry from devicetree binding
drivers: mtd: chips: add support for the dual die stacked PNOR
.../devicetree/bindings/mtd/mtd-physmap.txt | 2 +
drivers/mtd/chips/cfi_cmdset_0002.c | 144 ++++++++++++++++-----
drivers/mtd/chips/cfi_probe.c | 7 +
include/linux/mtd/cfi.h | 8 ++
4 files changed, 130 insertions(+), 31 deletions(-)
--
2.7.4
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