[PATCH v2] arm64: dts: rockchip: enable built-in thermal monitoring on rk3588
Daniel Lezcano
daniel.lezcano at linaro.org
Sun Jan 21 16:04:38 PST 2024
Hi Alexey,
On 21/01/2024 20:57, Alexey Charkov wrote:
> On Fri, Jan 19, 2024 at 8:21 PM Daniel Lezcano
> <daniel.lezcano at linaro.org> wrote:
> Hello Daniel,
>
> Thanks a lot for your review and comments! Please see some reflections below.
>
>> On 09/01/2024 20:19, Alexey Charkov wrote:
>>> Include thermal zones information in device tree for rk3588 variants
>>> and enable the built-in thermal sensing ADC on RADXA Rock 5B
>>>
>>> Signed-off-by: Alexey Charkov <alchark at gmail.com>
>>> ---
>>> Changes in v2:
>>> - Dropped redundant comments
>>> - Included all CPU cores in cooling maps
>>> - Split cooling maps into more granular ones utilizing TSADC
>>> channels 1-3 which measure temperature by separate CPU clusters
>>> instead of channel 0 which measures the center of the SoC die
>>> ---
>>> .../boot/dts/rockchip/rk3588-rock-5b.dts | 4 +
>>> arch/arm64/boot/dts/rockchip/rk3588s.dtsi | 151 ++++++++++++++++++
>>> 2 files changed, 155 insertions(+)
>>>
>>> diff --git a/arch/arm64/boot/dts/rockchip/rk3588-rock-5b.dts b/arch/arm64/boot/dts/rockchip/rk3588-rock-5b.dts
>>> index a5a104131403..f9d540000de3 100644
>>> --- a/arch/arm64/boot/dts/rockchip/rk3588-rock-5b.dts
>>> +++ b/arch/arm64/boot/dts/rockchip/rk3588-rock-5b.dts
>>> @@ -772,3 +772,7 @@ &usb_host1_ehci {
>>> &usb_host1_ohci {
>>> status = "okay";
>>> };
>>> +
>>> +&tsadc {
>>> + status = "okay";
>>> +};
>>> diff --git a/arch/arm64/boot/dts/rockchip/rk3588s.dtsi b/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
>>> index 8aa0499f9b03..8d54998d0ecc 100644
>>> --- a/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
>>> +++ b/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
>>> @@ -10,6 +10,7 @@
>>> #include <dt-bindings/reset/rockchip,rk3588-cru.h>
>>> #include <dt-bindings/phy/phy.h>
>>> #include <dt-bindings/ata/ahci.h>
>>> +#include <dt-bindings/thermal/thermal.h>
>>>
>>> / {
>>> compatible = "rockchip,rk3588";
>>> @@ -2112,6 +2113,156 @@ tsadc: tsadc at fec00000 {
>>> status = "disabled";
>>> };
>>>
>>> + thermal_zones: thermal-zones {
>>> + /* sensor near the center of the whole chip */
>>> + soc_thermal: soc-thermal {
>>> + polling-delay-passive = <20>;
>>
>> There is no mitigation set for this thermal zone. It is pointless to
>> specify a passive polling.
>
> Indeed, it makes sense to me. There seems to be a catch though in that
> the driver calls the generic thermal_of_zone_register during the
> initial probe, which expects both of those polling delays to be
> present in the device tree, otherwise it simply refuses to add the
> respective thermal zone, see drivers/thermal/thermal_of.c:502
Usually:
polling-delay-passive = <0>;
polling-delay = <0>;
cf:
git grep "polling-delay = <0>" arch/arm64/boot/dts
>>> + polling-delay = <1000>;
>>
>> The driver is interrupt driven. No need to poll.
>
> Same here as above
>
>>> + sustainable-power = <2100>;
>>
>> There is no mitigation with this thermal zone. Specifying a sustainable
>> power does not make sense.
>
> Thanks, will drop this in v3!
>
>>> + thermal-sensors = <&tsadc 0>;
>>> +
>>> + trips {
>>> + soc_crit: soc-crit {
>>> + temperature = <115000>;
>>> + hysteresis = <2000>;
>>
>> This trip point leads to a system shutdown / reboot. It is not necessary
>> to specify a hysteresis.
>
> Similar to the above, the generic thermal_of code refuses to add the
> trip point if it has no hysteresis property defined (regardless of the
> trip type), see drivers/thermal/thermal_of.c:109
hysteresis = <0>;
--
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