[PATCH v1 1/2] thermal: Add generic device cooling support

[Alice Guo (OSS)]

Hi,

I did not reply in time. Sorry to bother you. Please ignore this patchset.

Best Regards,
Alice Guo

> -----Original Message-----
> From: Daniel Lezcano <daniel.lezcano at linaro.org>
> Sent: Thursday, January 5, 2023 5:59 PM
> To: Alice Guo (OSS) <alice.guo at oss.nxp.com>; rafael at kernel.org;
> amitk at kernel.org; rui.zhang at intel.com; Aisheng Dong
> <aisheng.dong at nxp.com>; shawnguo at kernel.org; Leo Li
> <leoyang.li at nxp.com>
> Cc: linux-arm-kernel at lists.infradead.org; linux-pm at vger.kernel.org;
> linux-kernel at vger.kernel.org
> Subject: Re: [PATCH v1 1/2] thermal: Add generic device cooling support
> 
> On 05/01/2023 09:22, Alice Guo (OSS) wrote:
> > From: Anson Huang <Anson.Huang at nxp.com>
> >
> > To compatible with previous implementation, add generic device cooling
> > support, each thermal zone will register a cooling device, and when
> > temperature exceed passive trip, the device cooling driver will send
> > out a system wide notification, each device supporting cooling will
> > need to register device cooling and takes action when passive trip is
> > exceeded;
> 
> Can you explain the use case you want to solve with this solution and the
> limitations of the existing ones ?
> 
> 
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