[PATCH 2/3] thermal: hisilicon: add thermal sensor driver for Hi3660

Wangtao (Kevin, Kirin) kevin.wangtao at hisilicon.com
Tue Jun 20 19:21:11 PDT 2017



e
( 2017/6/20 18:31, Wei Xu ei:
> Hi Tao Wang,
> 
> On 2017/6/20 4:40, Tao Wang wrote:
>> This patch adds the support for thermal sensor of Hi3660 SoC.
>> this will register sensors for thermal framework and use device
>> tree to bind cooling device.
>>
>> Signed-off-by: Tao Wang <kevin.wangtao at hisilicon.com>
>> Signed-off-by: Leo Yan <leo.yan at linaro.org>
>> ---
>>   drivers/thermal/Kconfig          |   10 ++
>>   drivers/thermal/Makefile         |    1 +
>>   drivers/thermal/hi3660_thermal.c |  198 ++++++++++++++++++++++++++++++++++++++
>>   3 files changed, 209 insertions(+)
>>   create mode 100644 drivers/thermal/hi3660_thermal.c
>>
>> diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
>> index b5b5fac..3e7fa95 100644
>> --- a/drivers/thermal/Kconfig
>> +++ b/drivers/thermal/Kconfig
>> @@ -203,6 +203,16 @@ config HISI_THERMAL
>>   	  thermal framework. cpufreq is used as the cooling device to throttle
>>   	  CPUs when the passive trip is crossed.
>>   
>> +config HI3660_THERMAL
> 
> Please keep alphabet order and swap the order
> between HI3660_THERMAL and HISI_THERMAL.
OK
> 
> Thanks!
> 
> BR,
> Wei
> 
>> +	tristate "Hi3660 thermal driver"
>> +	depends on ARCH_HISI || COMPILE_TEST
>> +	depends on HAS_IOMEM
>> +	depends on OF
>> +	default y
>> +	help
>> +	  Enable this to plug Hi3660 thermal driver into the Linux thermal
>> +	  framework.
>> +
>>   config IMX_THERMAL
>>   	tristate "Temperature sensor driver for Freescale i.MX SoCs"
>>   	depends on (ARCH_MXC && CPU_THERMAL) || COMPILE_TEST
>> diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
>> index 094d703..f29d0a5 100644
>> --- a/drivers/thermal/Makefile
>> +++ b/drivers/thermal/Makefile
>> @@ -55,6 +55,7 @@ obj-$(CONFIG_INTEL_PCH_THERMAL)	+= intel_pch_thermal.o
>>   obj-$(CONFIG_ST_THERMAL)	+= st/
>>   obj-$(CONFIG_QCOM_TSENS)	+= qcom/
>>   obj-$(CONFIG_TEGRA_SOCTHERM)	+= tegra/
>> +obj-$(CONFIG_HI3660_THERMAL)	+= hi3660_thermal.o
>>   obj-$(CONFIG_HISI_THERMAL)     += hisi_thermal.o
>>   obj-$(CONFIG_MTK_THERMAL)	+= mtk_thermal.o
>>   obj-$(CONFIG_GENERIC_ADC_THERMAL)	+= thermal-generic-adc.o
>> diff --git a/drivers/thermal/hi3660_thermal.c b/drivers/thermal/hi3660_thermal.c
>> new file mode 100644
>> index 0000000..a538721
>> --- /dev/null
>> +++ b/drivers/thermal/hi3660_thermal.c
>> @@ -0,0 +1,198 @@
>> +/*
>> + *  linux/drivers/thermal/hi3660_thermal.c
>> + *
>> + *  Copyright (c) 2017 Hisilicon Limited.
>> + *  Copyright (c) 2017 Linaro Limited.
>> + *
>> + *  Author: Tao Wang <kevin.wangtao at hisilicon.com>
>> + *  Author: Leo Yan <leo.yan at linaro.org>
>> + *
>> + *  This program is free software; you can redistribute it and/or modify
>> + *  it under the terms of the GNU General Public License as published by
>> + *  the Free Software Foundation; version 2 of the License.
>> + *
>> + *  This program is distributed in the hope that it will be useful,
>> + *  but WITHOUT ANY WARRANTY; without even the implied warranty of
>> + *  MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.  See the
>> + *  GNU General Public License for more details.
>> + *
>> + *  You should have received a copy of the GNU General Public License
>> + *  along with this program.  If not, see <http://www.gnu.org/licenses/>.
>> + */
>> +
>> +#include <linux/clk.h>
>> +#include <linux/device.h>
>> +#include <linux/err.h>
>> +#include <linux/io.h>
>> +#include <linux/kernel.h>
>> +#include <linux/of.h>
>> +#include <linux/module.h>
>> +#include <linux/platform_device.h>
>> +#include <linux/thermal.h>
>> +
>> +#include "thermal_core.h"
>> +
>> +#define HW_MAX_SENSORS			4
>> +#define HISI_MAX_SENSORS		6
>> +#define SENSOR_MAX			4
>> +#define SENSOR_AVG			5
>> +
>> +#define ADC_MIN		116
>> +#define ADC_MAX		922
>> +
>> +/* hi3660 Thermal Sensor Dev Structure */
>> +struct hi3660_thermal_sensor {
>> +	struct hi3660_thermal_data *thermal;
>> +	struct thermal_zone_device *tzd;
>> +
>> +	uint32_t id;
>> +};
>> +
>> +struct hi3660_thermal_data {
>> +	struct platform_device *pdev;
>> +	struct hi3660_thermal_sensor sensors[HISI_MAX_SENSORS];
>> +	void __iomem *thermal_base;
>> +};
>> +
>> +unsigned int sensor_reg_offset[HW_MAX_SENSORS] = { 0x1c, 0x5c, 0x9c, 0xdc };
>> +
>> +
>> +static int hi3660_thermal_get_temp(void *_sensor, int *temp)
>> +{
>> +	struct hi3660_thermal_sensor *sensor = _sensor;
>> +	struct hi3660_thermal_data *data = sensor->thermal;
>> +	unsigned int idx;
>> +	int val, average = 0, max = 0;
>> +
>> +	if (sensor->id < HW_MAX_SENSORS) {
>> +		val = readl(data->thermal_base + sensor_reg_offset[sensor->id]);
>> +		val = clamp_val(val, ADC_MIN, ADC_MAX);
>> +	} else {
>> +		for (idx = 0; idx < HW_MAX_SENSORS; idx++) {
>> +			val = readl(data->thermal_base
>> +					+ sensor_reg_offset[idx]);
>> +			val = clamp_val(val, ADC_MIN, ADC_MAX);
>> +			average += val;
>> +			if (val > max)
>> +				max = val;
>> +		}
>> +
>> +		if (sensor->id == SENSOR_MAX)
>> +			val = max;
>> +		else if (sensor->id == SENSOR_AVG)
>> +			val = average / HW_MAX_SENSORS;
>> +	}
>> +
>> +	*temp = ((val - ADC_MIN) * 165000) / (ADC_MAX - ADC_MIN) - 40000;
>> +
>> +	return 0;
>> +}
>> +
>> +static struct thermal_zone_of_device_ops hi3660_of_thermal_ops = {
>> +	.get_temp = hi3660_thermal_get_temp,
>> +};
>> +
>> +static int hi3660_thermal_register_sensor(struct platform_device *pdev,
>> +		struct hi3660_thermal_data *data,
>> +		struct hi3660_thermal_sensor *sensor,
>> +		int index)
>> +{
>> +	int ret = 0;
>> +
>> +	sensor->id = index;
>> +	sensor->thermal = data;
>> +
>> +	sensor->tzd = devm_thermal_zone_of_sensor_register(&pdev->dev,
>> +				sensor->id, sensor, &hi3660_of_thermal_ops);
>> +	if (IS_ERR(sensor->tzd)) {
>> +		ret = PTR_ERR(sensor->tzd);
>> +		sensor->tzd = NULL;
>> +	}
>> +
>> +	return ret;
>> +}
>> +
>> +static void hi3660_thermal_toggle_sensor(struct hi3660_thermal_sensor *sensor,
>> +				       bool on)
>> +{
>> +	struct thermal_zone_device *tzd = sensor->tzd;
>> +
>> +	tzd->ops->set_mode(tzd,
>> +		on ? THERMAL_DEVICE_ENABLED : THERMAL_DEVICE_DISABLED);
>> +}
>> +
>> +static int hi3660_thermal_probe(struct platform_device *pdev)
>> +{
>> +	struct device *dev = &pdev->dev;
>> +	struct hi3660_thermal_data *data;
>> +	struct resource *res;
>> +	int ret = 0;
>> +	int i;
>> +
>> +	data = devm_kzalloc(dev, sizeof(*data), GFP_KERNEL);
>> +	if (!data)
>> +		return -ENOMEM;
>> +
>> +	data->pdev = pdev;
>> +	res = platform_get_resource(pdev, IORESOURCE_MEM, 0);
>> +	data->thermal_base = devm_ioremap_resource(dev, res);
>> +	if (IS_ERR(data->thermal_base)) {
>> +		dev_err(dev, "failed get reg base\n");
>> +		return -ENOMEM;
>> +	}
>> +
>> +	platform_set_drvdata(pdev, data);
>> +
>> +	for (i = 0; i < HISI_MAX_SENSORS; ++i) {
>> +		ret = hi3660_thermal_register_sensor(pdev, data,
>> +						     &data->sensors[i], i);
>> +		if (ret)
>> +			dev_err(&pdev->dev,
>> +				"failed to register thermal sensor%d: %d\n",
>> +				i, ret);
>> +		else
>> +			hi3660_thermal_toggle_sensor(&data->sensors[i], true);
>> +	}
>> +
>> +	dev_info(&pdev->dev, "Thermal Sensor Loaded\n");
>> +	return 0;
>> +}
>> +
>> +static int hi3660_thermal_exit(struct platform_device *pdev)
>> +{
>> +	struct hi3660_thermal_data *data = platform_get_drvdata(pdev);
>> +	int i;
>> +
>> +	for (i = 0; i < HISI_MAX_SENSORS; i++) {
>> +		struct hi3660_thermal_sensor *sensor = &data->sensors[i];
>> +
>> +		if (!sensor->tzd)
>> +			continue;
>> +
>> +		hi3660_thermal_toggle_sensor(sensor, false);
>> +	}
>> +
>> +	return 0;
>> +}
>> +
>> +static const struct of_device_id hi3660_thermal_id_table[] = {
>> +	{ .compatible = "hisilicon,thermal-hi3660" },
>> +	{}
>> +};
>> +MODULE_DEVICE_TABLE(of, hi3660_thermal_id_table);
>> +
>> +static struct platform_driver hi3660_thermal_driver = {
>> +	.probe = hi3660_thermal_probe,
>> +	.remove = hi3660_thermal_exit,
>> +	.driver = {
>> +		.name = "hi3660_thermal",
>> +		.of_match_table = hi3660_thermal_id_table,
>> +	},
>> +};
>> +
>> +module_platform_driver(hi3660_thermal_driver);
>> +
>> +MODULE_AUTHOR("Tao Wang <kevin.wangtao at hisilicon.com>");
>> +MODULE_AUTHOR("Leo Yan <leo.yan at linaro.org>");
>> +MODULE_DESCRIPTION("hi3660 thermal driver");
>> +MODULE_LICENSE("GPL v2");
>>
> 
> 
> .
> 




More information about the linux-arm-kernel mailing list