[PATCH 2/3] thermal: hisilicon: add thermal sensor driver for Hi3660
Tao Wang
kevin.wangtao at hisilicon.com
Mon Jun 19 20:40:34 PDT 2017
This patch adds the support for thermal sensor of Hi3660 SoC.
this will register sensors for thermal framework and use device
tree to bind cooling device.
Signed-off-by: Tao Wang <kevin.wangtao at hisilicon.com>
Signed-off-by: Leo Yan <leo.yan at linaro.org>
---
drivers/thermal/Kconfig | 10 ++
drivers/thermal/Makefile | 1 +
drivers/thermal/hi3660_thermal.c | 198 ++++++++++++++++++++++++++++++++++++++
3 files changed, 209 insertions(+)
create mode 100644 drivers/thermal/hi3660_thermal.c
diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
index b5b5fac..3e7fa95 100644
--- a/drivers/thermal/Kconfig
+++ b/drivers/thermal/Kconfig
@@ -203,6 +203,16 @@ config HISI_THERMAL
thermal framework. cpufreq is used as the cooling device to throttle
CPUs when the passive trip is crossed.
+config HI3660_THERMAL
+ tristate "Hi3660 thermal driver"
+ depends on ARCH_HISI || COMPILE_TEST
+ depends on HAS_IOMEM
+ depends on OF
+ default y
+ help
+ Enable this to plug Hi3660 thermal driver into the Linux thermal
+ framework.
+
config IMX_THERMAL
tristate "Temperature sensor driver for Freescale i.MX SoCs"
depends on (ARCH_MXC && CPU_THERMAL) || COMPILE_TEST
diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
index 094d703..f29d0a5 100644
--- a/drivers/thermal/Makefile
+++ b/drivers/thermal/Makefile
@@ -55,6 +55,7 @@ obj-$(CONFIG_INTEL_PCH_THERMAL) += intel_pch_thermal.o
obj-$(CONFIG_ST_THERMAL) += st/
obj-$(CONFIG_QCOM_TSENS) += qcom/
obj-$(CONFIG_TEGRA_SOCTHERM) += tegra/
+obj-$(CONFIG_HI3660_THERMAL) += hi3660_thermal.o
obj-$(CONFIG_HISI_THERMAL) += hisi_thermal.o
obj-$(CONFIG_MTK_THERMAL) += mtk_thermal.o
obj-$(CONFIG_GENERIC_ADC_THERMAL) += thermal-generic-adc.o
diff --git a/drivers/thermal/hi3660_thermal.c b/drivers/thermal/hi3660_thermal.c
new file mode 100644
index 0000000..a538721
--- /dev/null
+++ b/drivers/thermal/hi3660_thermal.c
@@ -0,0 +1,198 @@
+/*
+ * linux/drivers/thermal/hi3660_thermal.c
+ *
+ * Copyright (c) 2017 Hisilicon Limited.
+ * Copyright (c) 2017 Linaro Limited.
+ *
+ * Author: Tao Wang <kevin.wangtao at hisilicon.com>
+ * Author: Leo Yan <leo.yan at linaro.org>
+ *
+ * This program is free software; you can redistribute it and/or modify
+ * it under the terms of the GNU General Public License as published by
+ * the Free Software Foundation; version 2 of the License.
+ *
+ * This program is distributed in the hope that it will be useful,
+ * but WITHOUT ANY WARRANTY; without even the implied warranty of
+ * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
+ * GNU General Public License for more details.
+ *
+ * You should have received a copy of the GNU General Public License
+ * along with this program. If not, see <http://www.gnu.org/licenses/>.
+ */
+
+#include <linux/clk.h>
+#include <linux/device.h>
+#include <linux/err.h>
+#include <linux/io.h>
+#include <linux/kernel.h>
+#include <linux/of.h>
+#include <linux/module.h>
+#include <linux/platform_device.h>
+#include <linux/thermal.h>
+
+#include "thermal_core.h"
+
+#define HW_MAX_SENSORS 4
+#define HISI_MAX_SENSORS 6
+#define SENSOR_MAX 4
+#define SENSOR_AVG 5
+
+#define ADC_MIN 116
+#define ADC_MAX 922
+
+/* hi3660 Thermal Sensor Dev Structure */
+struct hi3660_thermal_sensor {
+ struct hi3660_thermal_data *thermal;
+ struct thermal_zone_device *tzd;
+
+ uint32_t id;
+};
+
+struct hi3660_thermal_data {
+ struct platform_device *pdev;
+ struct hi3660_thermal_sensor sensors[HISI_MAX_SENSORS];
+ void __iomem *thermal_base;
+};
+
+unsigned int sensor_reg_offset[HW_MAX_SENSORS] = { 0x1c, 0x5c, 0x9c, 0xdc };
+
+
+static int hi3660_thermal_get_temp(void *_sensor, int *temp)
+{
+ struct hi3660_thermal_sensor *sensor = _sensor;
+ struct hi3660_thermal_data *data = sensor->thermal;
+ unsigned int idx;
+ int val, average = 0, max = 0;
+
+ if (sensor->id < HW_MAX_SENSORS) {
+ val = readl(data->thermal_base + sensor_reg_offset[sensor->id]);
+ val = clamp_val(val, ADC_MIN, ADC_MAX);
+ } else {
+ for (idx = 0; idx < HW_MAX_SENSORS; idx++) {
+ val = readl(data->thermal_base
+ + sensor_reg_offset[idx]);
+ val = clamp_val(val, ADC_MIN, ADC_MAX);
+ average += val;
+ if (val > max)
+ max = val;
+ }
+
+ if (sensor->id == SENSOR_MAX)
+ val = max;
+ else if (sensor->id == SENSOR_AVG)
+ val = average / HW_MAX_SENSORS;
+ }
+
+ *temp = ((val - ADC_MIN) * 165000) / (ADC_MAX - ADC_MIN) - 40000;
+
+ return 0;
+}
+
+static struct thermal_zone_of_device_ops hi3660_of_thermal_ops = {
+ .get_temp = hi3660_thermal_get_temp,
+};
+
+static int hi3660_thermal_register_sensor(struct platform_device *pdev,
+ struct hi3660_thermal_data *data,
+ struct hi3660_thermal_sensor *sensor,
+ int index)
+{
+ int ret = 0;
+
+ sensor->id = index;
+ sensor->thermal = data;
+
+ sensor->tzd = devm_thermal_zone_of_sensor_register(&pdev->dev,
+ sensor->id, sensor, &hi3660_of_thermal_ops);
+ if (IS_ERR(sensor->tzd)) {
+ ret = PTR_ERR(sensor->tzd);
+ sensor->tzd = NULL;
+ }
+
+ return ret;
+}
+
+static void hi3660_thermal_toggle_sensor(struct hi3660_thermal_sensor *sensor,
+ bool on)
+{
+ struct thermal_zone_device *tzd = sensor->tzd;
+
+ tzd->ops->set_mode(tzd,
+ on ? THERMAL_DEVICE_ENABLED : THERMAL_DEVICE_DISABLED);
+}
+
+static int hi3660_thermal_probe(struct platform_device *pdev)
+{
+ struct device *dev = &pdev->dev;
+ struct hi3660_thermal_data *data;
+ struct resource *res;
+ int ret = 0;
+ int i;
+
+ data = devm_kzalloc(dev, sizeof(*data), GFP_KERNEL);
+ if (!data)
+ return -ENOMEM;
+
+ data->pdev = pdev;
+ res = platform_get_resource(pdev, IORESOURCE_MEM, 0);
+ data->thermal_base = devm_ioremap_resource(dev, res);
+ if (IS_ERR(data->thermal_base)) {
+ dev_err(dev, "failed get reg base\n");
+ return -ENOMEM;
+ }
+
+ platform_set_drvdata(pdev, data);
+
+ for (i = 0; i < HISI_MAX_SENSORS; ++i) {
+ ret = hi3660_thermal_register_sensor(pdev, data,
+ &data->sensors[i], i);
+ if (ret)
+ dev_err(&pdev->dev,
+ "failed to register thermal sensor%d: %d\n",
+ i, ret);
+ else
+ hi3660_thermal_toggle_sensor(&data->sensors[i], true);
+ }
+
+ dev_info(&pdev->dev, "Thermal Sensor Loaded\n");
+ return 0;
+}
+
+static int hi3660_thermal_exit(struct platform_device *pdev)
+{
+ struct hi3660_thermal_data *data = platform_get_drvdata(pdev);
+ int i;
+
+ for (i = 0; i < HISI_MAX_SENSORS; i++) {
+ struct hi3660_thermal_sensor *sensor = &data->sensors[i];
+
+ if (!sensor->tzd)
+ continue;
+
+ hi3660_thermal_toggle_sensor(sensor, false);
+ }
+
+ return 0;
+}
+
+static const struct of_device_id hi3660_thermal_id_table[] = {
+ { .compatible = "hisilicon,thermal-hi3660" },
+ {}
+};
+MODULE_DEVICE_TABLE(of, hi3660_thermal_id_table);
+
+static struct platform_driver hi3660_thermal_driver = {
+ .probe = hi3660_thermal_probe,
+ .remove = hi3660_thermal_exit,
+ .driver = {
+ .name = "hi3660_thermal",
+ .of_match_table = hi3660_thermal_id_table,
+ },
+};
+
+module_platform_driver(hi3660_thermal_driver);
+
+MODULE_AUTHOR("Tao Wang <kevin.wangtao at hisilicon.com>");
+MODULE_AUTHOR("Leo Yan <leo.yan at linaro.org>");
+MODULE_DESCRIPTION("hi3660 thermal driver");
+MODULE_LICENSE("GPL v2");
--
1.7.9.5
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