[PATCH v2 5/7] arm64: dts: exynos: Add dts files for Samsung Exynos5433 64bit SoC

[Krzysztof Kozlowski]

On Wed, Aug 24, 2016 at 10:49:09PM +0900, Chanwoo Choi wrote:
> This patch adds new Exynos5433 dtsi to support 64-bit Exynos5433 SoC based on
> Octa-core CPUs (quad Cortex-A57 and quad Cortex-A53). And Exynos5433 supports
> PSCI (Power State Coordination Interface) v0.1.
> 
> This patch includes following Device Tree node to support Exynos5433 SoC:
> 1. Octa cores for big.LITTLE architecture
> - Cortex-A53 LITTLE Quad-core
> - Cortex-A57 big Quad-core
> - Support PSCI v0.1
> 
> 2. Clock controller node
> - CMU_TOP   : clocks for IMEM/FSYS/G3D/GSCL/HEVC/MSCL/G2D/MFC/PERIC/PERIS
> - CMU_CPIF  : clocks for LLI (Low Latency Interface)
> - CMU_MIF   : clocks for DRAM Memory Controller
> - CMU_PERIC : clocks for UART/I2C/SPI/I2S/PCM/SPDIF/PWM/SLIMBUS
> - CMU_PERIS : clocks for PMU/TMU/MCT/WDT/RTC/SECKEY/TZPC
> - CMU_FSYS  : clocks for USB/UFS/SDMMC/TSI/PDMA
> - CMU_G2D   : clocks for G2D/MDMA
> - CMU_DISP  : clocks for DECON/HDMI/DSIM/MIXER
> - CMU_AUD   : clocks for Cortex-A5/BUS/AUDIO
> - CMU_BUS{0|1|2} : clocks for global data buses and global peripheral buses
> - CMU_G3D   : clocks for 3D Graphics Engine
> - CMU_GSCL  : clocks for GSCALER
> - CMU_APOLLO: clocks for Cortex-A53 Quad-core processor.
> - CMU_ATLAS : clocks for Cortex-A57 Quad-core processor,
>               CoreSight and L2 cache controller.
> - CMU_MSCL  : clocks for M2M (Memory to Memory) scaler and JPEG IPs.
> - CMU_MFC   : clocks for MFC (Multi-Format Codec) IP.
> - CMU_HEVC  : clocks for HEVC(High Efficiency Video Codec) decoder IP.
> - CMU_ISP   : clocks for FIMC-ISP/DRC/SCLC/DIS/3DNR IPs.
> - CMU_CAM0  : clocks for MIPI_CSIS{0|1}/FIMC_LITE_{A|B|D}/FIMC_3AA{0|1} IPs.
> - CMU_CAM1  : clocks for COrtex-A5/MIPI_CSIS2/FIMC_LITE_C/FIMC-FD IPs.
> 
> 3. pinctrl node for GPIO
> - alive/aud/cpif/ese/finger/fsys/imem/nfc/peric/touch pad
> 
> 4. Timer
> - ARM architecture timer (armv8-timer)
> - MCT (Multi Core Timer) timer
> 
> 5. Interrupt controller (GIC-400)
> 
> 6. BUS devices
> - HS-I2C (High-Speed I2C) device
> - SPI (Serial Peripheral Interface) device
> 
> 7. Sound devices
> - I2S bus
> - LPASS (Low Power Audio Subsystem)
> 
> 8. Power management devices
> - CPUFREQ for for Cortex-A53/A57
> - TMU (Thermal Management Unit) for Cortex-A53/A57, G3D, ISP
> 
> 9. Display controller devices
> - DECON (Display and enhancement controller) for panel output
> - DSI (Display Serial Interface)
> - MIC (Mobile Image Compressor)
> 
> 10. USB
> - USB 3.0 DRD (Dual Role Device) controller
> - USB 3.0 Host controller
> 
> 11. Storage devices
> - MSHC (Mobile Stoarage Host Controller)
> 
> 12. Misc devices
> - UART device
> - ADC (Analog Digital Converter)
> - PWM (Pulse Width Modulation)
> - ADMA (Advanced DMA) and PDMA (Peripheral DMA)
> 
> Signed-off-by: Chanwoo Choi <cw00.choi at samsung.com>
> Signed-off-by: Jaehoon Chung <jh80.chung at samsung.com>
> Signed-off-by: Seung-Woo Kim <sw0312.kim at samsung.com>
> Signed-off-by: Joonyoung Shim <jy0922.shim at samsung.com>
> Signed-off-by: Inki Dae <inki.dae at samsung.com>
> Signed-off-by: Jonghwa Lee <jonghwa3.lee at samsung.com>
> Signed-off-by: Beomho Seo <beomho.seo at samsung.com>
> Signed-off-by: Jaewon Kim <jaewon02.kim at samsung.com>
> Signed-off-by: Hyungwon Hwang <human.hwang at samsung.com>
> Signed-off-by: Inha Song <ideal.song at samsung.com>
> Signed-off-by: Ingi kim <ingi2.kim at samsung.com>
> Signed-off-by: Krzysztof Kozlowski <k.kozlowski at samsung.com>
> Signed-off-by: Marek Szyprowski <m.szyprowski at samsung.com>
> Signed-off-by: Andrzej Hajda <a.hajda at samsung.com>
> Signed-off-by: Sylwester Nawrocki <s.nawrocki at samsung.com>
> ---
>  arch/arm64/boot/dts/exynos/exynos5433-pinctrl.dtsi |  792 ++++++++++++
>  .../dts/exynos/exynos5433-tmu-g3d-sensor-conf.dtsi |   23 +
>  .../dts/exynos/exynos5433-tmu-sensor-conf.dtsi     |   22 +
>  arch/arm64/boot/dts/exynos/exynos5433-tmu.dtsi     |  306 +++++
>  arch/arm64/boot/dts/exynos/exynos5433.dtsi         | 1327 ++++++++++++++++++++
>  5 files changed, 2470 insertions(+)
>  create mode 100644 arch/arm64/boot/dts/exynos/exynos5433-pinctrl.dtsi
>  create mode 100644 arch/arm64/boot/dts/exynos/exynos5433-tmu-g3d-sensor-conf.dtsi
>  create mode 100644 arch/arm64/boot/dts/exynos/exynos5433-tmu-sensor-conf.dtsi
>  create mode 100644 arch/arm64/boot/dts/exynos/exynos5433-tmu.dtsi
>  create mode 100644 arch/arm64/boot/dts/exynos/exynos5433.dtsi

I got only one question:

 +
> +		cooling-maps {
> +			map0 {
> +				/* Set maximum frequency as 1300MHz  */
> +				trip = <&apollo_alert_0>;
> +				cooling-device = <&cpu0 0 0>;

Is cooling level=0 really a cooling level? I think it does nothing so it
should be just removed.

The same for big cluster.

Rest looks good.

BR,
Krzysztof