[PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model

[Viresh Kumar]

On 22-10-15, 20:02, Dawei Chien wrote:
> Use Intelligent Power Allocation (IPA) technical to add static/dynamic power model for binding CPU thermal zone.
> The power allocator governor allocates power budget to control CPU temperature.
> 
> Power Allocator governor is able to keep SOC temperature within a defined temperature range to avoid SOC overheat and keep it's performance. mt8173-cpufreq.c need to register its' own power model with power allocator thermal governor, so that power allocator governor can allocates suitable power budget to control CPU temperature.
> 
> PATCH1 is base on
> https://patchwork.kernel.org/patch/7034601/
> 
> PATCH2 is base on Sascha's thermal driver V9
> https://patchwork.kernel.org/patch/7249821/
> https://patchwork.kernel.org/patch/7249861/
> https://patchwork.kernel.org/patch/7249891/
> 
> Change since V1:
> include mt8171.h and sort header file for mt8173.dtsi
> 
> Change since V2:
> Move dynamic/static power model in device tree
> 
> Dawei.Chien (2):
>   thermal: mediatek: Add cpu power cooling model.
>   arm64: dts: mt8173: Add thermal zone node for mt8173.

Sorry for being extremely late in reviewing this stuff. You are
already on v3 and I haven't reviewed it once. Mostly due to bad timing
of my holidays and other work pressure.

Now, there are few things that I feel are not properly addressed here,
and I may be wrong:
- Where are the bindings for static-power-points and
  dynamic-power-coefficient. Sorry I failed to see them in this or
  other series you mentioned.
- Even then, why should we be adding another table into DT for
  voltage/power ? And not reuse and extend the opp-v2 stuff which is
  already mainlined now.
- There are few issues with the code as well, but I want to see where
  the bindings should go first. And then only discuss the code
  further.

-- 
viresh