[PATCH v4 0/8] qcom: Add support for TSENS driver

[Rajendra Nayak]

On 11/03/2015 02:24 AM, Eduardo Valentin wrote:
> On Fri, Oct 09, 2015 at 03:11:02PM +0530, Rajendra Nayak wrote:
>> Patches 1/8 to 4/8 will need to go via the thermal tree/Eduardo.
>> Patches 5/8 to 8/8 will need to go via qcom-msm tree/Andy.
>>
>> Eduardo, can you please take a look at the patches and let me
>> know if you see any issues.
> 
> I have sent a couple of comments, most of them are not a big deal. But
> please, have a look on what concerns the thermal bindings. I want to
> reuse what we have as much as possible.

Sure, I'll take a look at the existing bindings.

> 
> The other point is regarding locking. Given that you have several
> sensors, per device, is there any need to have extra locking on top of
> what the thermal framework provides? Say, in the case a single device
> gets in use in different thermal zones, would the accesses to the
> thermal zone attempt to read registers shared by the sensors within
> the device?

I don't see a case where this should happen, but I will check again
to see if there a possibility of ending up with a situation like
this and if it needs additional locking.
Thanks Eduardo for the review.

regards,
Rajendra

> 
>>
>> Current set of patches apply on 4.3-rc4. Need to pull in clk-next
>> (for a dependent patch) to be able to test on ifc6410 board.
>>
>> Changes since v3:
>> * Dropped 'clk: qcom: create virtual child device for TSENS' which
>> is picked up by Stephen
>> * Updated GCC bindings with optional TSENS properties
>>
>> Changes since v2:
>> * Minor review fixes from Stephen/Punit and rebase on 4.3-rc4
>>
>> Changes since v1:
>> * Created virtual tsens device from gcc driver for 8960,
>> with DT having a single node for gcc and tsens
>> * Minor fixes with rebasing on 4.3-rc1
>>
>> Changes since RFC:
>> * Added support for 8916 and 8084
>> * Based off the latest nvmem framework patches [1]
>> * Minor review fixes for comments mostly from Lina
>>
>> This is an attempt to have a single TSENS driver for
>> the different versions of the TSENS IP that exist, on
>> different qcom msm/apq SoCs'
>> Support is added for msm8916, msm8960 and msm8974 families.
>>
>> A lot of the work is based of original code from Stephen Boyd
>> and Siddartha Mohanadoss. I have also picked some of what
>> Narendran Rajan did in his attempt to upstream the support
>> for 8960 family. I could not keep the original authorship on
>> any of the patches because I ended up moving the code around
>> quite a bit in an effort to have a single driver for the
>> various devices. I would be glad to change the authorship
>> for any of the patches if needed.
>>
>> Rajendra Nayak (8):
>>   thermal: qcom: tsens: Add a skeletal TSENS drivers
>>   thermal: qcom: tsens-8916: Add support for 8916 family of SoCs
>>   thermal: qcom: tsens-8974: Add support for 8974 family of SoCs
>>   thermal: qcom: tsens-8960: Add support for 8960 family of SoCs
>>   arm: dts: msm8974: Add thermal zones, tsens and qfprom nodes
>>   arm: dts: apq8064: Add thermal zones, tsens and qfprom nodes
>>   arm: dts: apq8084: Add thermal zones, tsens and qfprom nodes
>>   arm64: dts: msm8916: Add thermal zones, tsens and qfprom nodes
>>
>>  .../devicetree/bindings/clock/qcom,gcc.txt         |  20 ++
>>  .../devicetree/bindings/thermal/qcom-tsens.txt     |  33 +++
>>  arch/arm/boot/dts/qcom-apq8064.dtsi                | 101 +++++++
>>  arch/arm/boot/dts/qcom-apq8084.dtsi                | 105 ++++++++
>>  arch/arm/boot/dts/qcom-msm8974.dtsi                | 105 ++++++++
>>  arch/arm64/boot/dts/qcom/msm8916.dtsi              |  66 +++++
>>  drivers/thermal/Kconfig                            |   5 +
>>  drivers/thermal/Makefile                           |   1 +
>>  drivers/thermal/qcom/Kconfig                       |  10 +
>>  drivers/thermal/qcom/Makefile                      |   2 +
>>  drivers/thermal/qcom/tsens-8916.c                  | 107 ++++++++
>>  drivers/thermal/qcom/tsens-8960.c                  | 291 +++++++++++++++++++++
>>  drivers/thermal/qcom/tsens-8974.c                  | 239 +++++++++++++++++
>>  drivers/thermal/qcom/tsens-common.c                | 130 +++++++++
>>  drivers/thermal/qcom/tsens.c                       | 206 +++++++++++++++
>>  drivers/thermal/qcom/tsens.h                       |  69 +++++
>>  16 files changed, 1490 insertions(+)
>>  create mode 100644 Documentation/devicetree/bindings/thermal/qcom-tsens.txt
>>  create mode 100644 drivers/thermal/qcom/Kconfig
>>  create mode 100644 drivers/thermal/qcom/Makefile
>>  create mode 100644 drivers/thermal/qcom/tsens-8916.c
>>  create mode 100644 drivers/thermal/qcom/tsens-8960.c
>>  create mode 100644 drivers/thermal/qcom/tsens-8974.c
>>  create mode 100644 drivers/thermal/qcom/tsens-common.c
>>  create mode 100644 drivers/thermal/qcom/tsens.c
>>  create mode 100644 drivers/thermal/qcom/tsens.h
>>
>> -- 
>> QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member
>> of Code Aurora Forum, hosted by The Linux Foundation
>>

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