[PATCH v2 3/4] ARM: dts: exynos5250: Fold common ChromeOS parts into Snow

[Doug Anderson]

Andreas,

On Tue, Jul 29, 2014 at 5:45 AM, Andreas Färber <afaerber at suse.de> wrote:
> Doug,
>
> Am 25.07.2014 18:02, schrieb Doug Anderson:
>> On Fri, Jul 18, 2014 at 10:20 AM, Andreas Färber <afaerber at suse.de> wrote:
>>> +/*
>>> + * On Snow we've got SIP WiFi and so can keep drive strengths low to
>>> + * reduce EMI.
>>> + */
>>> +&mmc_3 {
>>> +       status = "okay";
>>> +       num-slots = <1>;
>>> +       supports-highspeed;
>>> +       broken-cd;
>>> +       card-detect-delay = <200>;
>>> +       samsung,dw-mshc-ciu-div = <3>;
>>> +       samsung,dw-mshc-sdr-timing = <2 3>;
>>> +       samsung,dw-mshc-ddr-timing = <1 2>;
>>> +
>>> +       slot at 0 {
>>> +               reg = <0>;
>>> +               bus-width = <4>;
>>> +               pinctrl-names = "default";
>>> +               pinctrl-0 = <&sd3_clk &sd3_cmd &sd3_bus4>;
>>
>> This actually looks like a bug on snow.  I don't think these pinctrl
>> statements are taking effect and I think they belong at the mmc level,
>> not the slot level.  That's not a new bug introduced by you, though.
>> Mind fixing it?  You've already got it right for Spring mmc_1.
>
> I was taught never to mix code movements with functional changes, as it
> hides them even if mentioned in the commit message. Would you like me to
> fix it pre- or post-move? Post-move would be easiest for me. ;)

Agreed.  Sorry for implying that it belonged as part of this patch.
I'd be happy if it was somewhere in the series, ideally before you
introduce the Spring device tree so diffs are cleaner for it.  I don't
care if it's pre-move or post-move.

-Doug