[source] kernel: package module for the W83793 hwmon chips

[LEDE Commits]

nbd pushed a commit to source.git, branch master:
https://git.lede-project.org/51b1d76f16c2a18b791d95bec556d07b1b6c8a3d

commit 51b1d76f16c2a18b791d95bec556d07b1b6c8a3d
Author: Florian Larysch <fl at n621.de>
AuthorDate: Thu Aug 4 14:04:26 2016 +0200

    kernel: package module for the W83793 hwmon chips
    
    Package the driver for the W83793 hwmon chip present on the T4240RDB.
    
    Signed-off-by: Florian Larysch <fl at n621.de>
---
 package/kernel/linux/modules/hwmon.mk | 15 +++++++++++++++
 1 file changed, 15 insertions(+)

diff --git a/package/kernel/linux/modules/hwmon.mk b/package/kernel/linux/modules/hwmon.mk
index 0a8115c..56cd0ec 100644
--- a/package/kernel/linux/modules/hwmon.mk
+++ b/package/kernel/linux/modules/hwmon.mk
@@ -298,6 +298,21 @@ endef
 $(eval $(call KernelPackage,hwmon-w83627hf))
 
 
+define KernelPackage/hwmon-w83793
+  TITLE:=Winbond W83793G/R monitoring support
+  KCONFIG:=CONFIG_SENSORS_W83793
+  FILES:=$(LINUX_DIR)/drivers/hwmon/w83793.ko
+  AUTOLOAD:=$(call AutoProbe,w83793)
+  $(call AddDepends/hwmon,+kmod-i2c-core +kmod-hwmon-vid)
+endef
+
+define KernelPackage/hwmon-w83793/description
+  Kernel module for the Winbond W83793G and W83793R chips.
+endef
+
+$(eval $(call KernelPackage,hwmon-w83793))
+
+
 define KernelPackage/hwmon-gsc
   TITLE:=Gateworks GSC monitoring support
   KCONFIG:=CONFIG_SENSORS_GSC